Huawei's homegrown AI chip examined — Chinese fab SMIC-produced Ascend 910B is massively different from the TSMC-produced Ascend 910 (www.tomshardware.com)
from schizoidman@lemm.ee to technology@lemmy.world on 29 Nov 15:47
https://lemm.ee/post/48587138

cross-posted from: lemm.ee/post/48587136

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riskable@programming.dev on 29 Nov 21:06 next collapse

I wonder what the yield is on these wafers? 🤔

Buffalox@lemmy.world on 30 Nov 10:57 collapse

This is a very interesting question, I speculate the process must be pretty good, otherwise it probably wouldn’t be used for such large chips.

HiSilicon Ascend 910B measures 21.32 mm × 31.22 mm and has an enlarged die size of 665.61 mm²

Compare that to AMD making the first Ryzen chiplets only 200 mm² on the GloFo 14nm process, to maximize yields, which was a huge advantage in the competition against Intel.

Mubelotix@jlai.lu on 30 Nov 09:41 collapse

We don’t talk about them